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Other (Paint) Coatings
CAS:77-71-4
Molecular Formula:C5H8N2O2
Alias
More Information
DMH; DM Hydantoin; Dimethylhydantoin; Dantoin DMH; 5,5-Dimethyl-2,4-Imidazolidinedione; 5,5-Dimethylimidazolidine-2,4-Dione
Brief Introduction
It can be used in the synthesis of amino acids, disinfectant, epoxy resin, etc.
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Daqing Rishengchang Petroleum And Chemical Technology Co.,Ltd.
≥99.0%
/
Tech Grade
25kg
/
Woven Bag
CAS:109-16-0
Molecular Formula:C14H22O6
Alias
More Information
(Ethane-1,2-Diylbis(Oxy))Bis(Ethane-2,1-Diyl) Bis(2-Methylacrylate); Triethyleneglycol Dimethylacrylate; Tgm 3; Tgm35; Ethy; Tgm3S; Tgm3Pc; 2-Propenoic Acid, 2-Methyl-, 1,2-Ethanediylbis(Oxy-2,1-Ethanediyl) Ester; Tedma; Tegdma; Nk Ester 3G
Brief Introduction
Unsaturated polyester resin (UPR) is one of the three most widely used matrix resin materials in resin matrix composites. It has excellent comprehensive properties, good processability, mechanical properties, corrosion resistance and electronic insulation. Therefore, it is widely used in automotive components, power engineering, chemical industry and other fields.
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Qingdao Renas Polymer Material Co.,Ltd.
≥97％
/
Tech Grade
200kg
/
Plastic Drum
CAS:61788-97-4
Molecular Formula:C21H23ClFNO2
Alias
More Information
Epoxy Resins; Phenolic Epoxy Resin; 4-[4-(4-Chlorophenyl)-4-Hydroxy-1-Piperidinyl]-1-(4-Fluorophenyl) -1-Butanone; Resin Epoxy; Heloxy Modifier 48; Resin M; Epx-125; Epu-618; Epco-1031; Epoxy; PER Based Epoxy Resin; Epoxyd
Brief Introduction
High molecular compounds containing epoxy groups in their molecular structures are collectively referred to as epoxy resins. The cured epoxy resin has good physical and chemical properties. It has excellent bonding strength to the surface of metal and non-metallic materials, good dielectric properties, small variable shrinkage, good dimensional stability of products, high hardness, good flexibility and stability to alkali and most solvents. Therefore, it is widely used in various departments of national defense and national economy for pouring, impregnation, lamination Adhesive, coating and other uses.
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Epoxy equiv 450-900 g/eq
/
Electronic Grade
50kg
/
Plastic Drum
CAS:25085-99-8
Molecular Formula:C21H24O4
Alias
More Information
Bisphenol Apoxyresin; Dow D.E.R. (R) 331 Epoxy Resin; Bisphenol A Diglycidyl Ether Polymer; Diglycidyl Bisphenol a Resin; Bisphenol-A Solid Epoxy Resin; D.E.R.(R) 332; Bisphenol-A Liquid Epoxy Resin
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Epoxy equiv 170-340 g/eq
/
Electronic Grade
200kg
/
Plastic Drum
CAS:21544-03-6
Molecular Formula:C14H18O6
Alias
More Information
MF-2282; bis(Oxiran-2-Ylmethyl) Cyclohex-4-ene-1,2-Dicarboxylate; 1,2,3,6-Tetrahydrophthalic Acid Diglycidyl Ester; 4-Cyclohexene-1,2-Dicarboxylic Acid Diglycidyl Ester; 4-Cyclohexene-1,2-Dicarboxylic Acid Bis(Oxiranylmethyl) Ester; 4-Cyclohexene-1,2-Dicarboxylic Acid Bis(Oxiran-2-Ylmethyl) Ester; Tetrahydrophthalic Acid Diglycidylester; Diglycidyl Tetrahydrophthalate Polymer
CNY 4 Million
29970m²
Less Than 50 People
Manufacturing
Manufacturing
| Product Photo | Specification | Grade | Max Capacity | Certificates | Package | |
|---|---|---|---|---|---|---|
|
||||||
| Tech Grade | - | - |
20kg /
Plastic Drum
200kg /
Iron Drum
|
Main products:
Bis(2,3-Epoxypropyl) Cyclohex-4-ene-1,2-Dicarboxylate
/4,4'-Methylenebis(N,N-Diglycidylaniline)
/N,N,N',N'Tetraglycidyl-1,3-bis-(Aminomethyl) Cyclohexane
/P-(2,3-Epoxypropoxy)-N,N-bis(2,3-Epoxypropyl)Aniline
/Bis(Oxiran-2-Ylmethyl) 7-Oxabicyclo[4.1.0]Heptane-3,4-Dicarboxylate
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