CAS:25054-06-2
Molecular Formula:C6H10O.CH2O
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Formaldehyde, Compd. with Cyclohexanone (1:1); Cyclohexanon -Formaldehyd (1:1); Cyclohexanone - Formaldéhyde (1:1); Ketone Resin; Polyketone Resin
CAS:25086-15-1
Molecular Formula:C9H14O4
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Methyl 2-Methylprop-2-Enoate,2-Methylprop-2-Enoic acid; PAMA; Methacrylic acid Copolymer type C; Methacrylic acid and Methyl Methacrylate Copolymer; Methacrylic acid Copolymer type B; Poly(Methyl Methacrylate-co-Methacrylic acid); Methacrylic acid Copolymer type A (Poly(Methacrylic acid-co-Methyl Methacrylate); Poly(Methacrylic acid-co-Methyl Methacrylate); Polymethacrylate; Methacrylic acid and Methyl Methacrylate Copolymer (1:1); Methacrylic acid Methylacrylate Copolymer 1:1
Brief Introduction
Practically insoluble in water, freely soluble in anhydrous ethanol and in 2-propanol, practically insoluble in ethyl acetate. It is freely soluble in a 40 g/L solution of sodium hydroxide.
CAS:25103-87-1
Molecular Formula:C10H20O6
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Poly(1,4-Butylene Adipate); Hexanedioic Acid,Polymer With 1,4-Butanediol; Poly(1,4-Butylene Adipate),Diol End-Capped; 1,4-Butylene Adipate Polymer; Poly(1,4-Butanediol Adipate); PBA; Poly(1,4-Butylene Adipate), Diol End-Capped; Hexanedioicacid,Polymerwith1,4-Butanediol; Polybutyleneglycoladipate; Butanediol/Adipic Acid Copolymer
Brief Introduction
It has a wide range of applications in the textile coating industry both domestically and internationally, and can be used for sizing, printing, and finishing. Textiles treated with it have advantages such as straightness and aesthetics.
CAS:25134-21-8
Molecular Formula:C10H10O3
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Methyl Nadic Anhydride; Epon Hardener Mna; Epon(R) Mna Substitute; Epoxy Embedding Medium, Hardener Mna; Methendic Anhydride; Methyl-3,6-Endomethylenetetrahydrophthalic Anhydride; Methylbicyclo[2.2.1]Hept-5-Ene-2,3-Dicarboxylic Anhydride; Methylnorbornene-2,3-Dicarboxylic Acid Anhydride; Methylnorbornene-2,3-Dicarboxylic Anhydride; Nadic Methyl Anhydride; Nadic(R) Methyl Anhydride; Nadic(Tm) Methyl Anhydride; 7-Methanoisobenzofuran-1,3-Dione,3A,4,7,7A-Tetrahydromethyl-; Methyl-5-Norbornene-2,3-Dicarboxylic Anhydride
Brief Introduction
This product is mainly used as epoxy resin curing agent. It is suitable for casting, lamination, powder molding, etc. the cured product has excellent weather resistance.
CAS:25135-51-7
Molecular Formula:C27H26O6S
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Polysulfone Resin,Pellets,Nominal M.W. 75000(Gpc); Psu; Poly(Oxy-1,4-Phenylenesulfonyl-1,4-Phenyleneoxy-1,4-Phenylene(1-Methylethylidene)-1,4-Phenylene); Poly(Phenylenesulfone); Polysulfonep1700; Ppsf; Ppsu; Psf; Polysulfone Resin, Pellets
Brief Introduction
Electrical appliances, electronics, instruments, meters and aerospace departments make heat-resistant, corrosion-resistant and high-strength parts, insulating parts, industrial films, etc
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