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Epoxy Base Electronic Material Corporation Limited

29 YRS

Guangdong, China

CNY 903.9 Million

53280 m²

500-1000 people

Main Products: Bisphenol-A Epoxy Resin / Epoxy Resin

Guangdong, China

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Copper Foil Substrate Dedicated Epoxy-FR4 Series

Copper Foil Substrate Dedicated Epoxy-FR4 Series / CAS 61788-97-4

Epoxy equiv 420-495 g/eq

OVERVIEW

Uses

Bisphenol-A Epoxy Resin Bisphenol-A Epoxy Resin

Packaging

200 KG/Plastic Drum

Lead Time

14-30 days

Max Capacity

155000 MT/Year

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DESCRIPTION

Epoxy resin for copper foil substrate

FR4 series

Typical Properties

High molecular compounds containing epoxy groups in their molecular structures are collectively referred to as epoxy resins. The cured epoxy resin has good physical and chemical properties. It has excellent bonding strength to the surface of metal and non-metallic materials, good dielectric properties, small variable shrinkage, good dimensional stability of products, high hardness, good flexibility and stability to alkali and most solvents. Therefore, it is widely used in various departments of national defense and national economy for pouring, impregnation, lamination Adhesive, coating and other uses.

CAS No.

61788-97-4

Formula

C21H23ClFNO2

Molecular Mass

375.86400

Exact Mass

375.14000

PSA

29.54000

Logp

4.75120

SMILES

C1CN(CCC1(C2=CC=C(C=C2)Cl)O)CCCC(=O)C3=CC=C(C=C3)F

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