CAS No.: 7722-84-1

Hydrogen peroxide content: 30~35%

Molecular formula: H2O2

Structural type:

Water solubility: miscible

Stability: slight instability

Storage conditions: the warehouse is ventilated, low-temperature and dry, and stored separately from fuel and organic matter

Product Description: electronic grade hydrogen peroxide (UP Grade) uses integrated circuits of more than 0.8 microns and TFT-LCD manufacturing process. The content of metal impurities is less than 10PPb. The product is filtered through 0.2 micron aperture, controlled by 0.5 micron particles, and filled in a 100 grade purification environment to meet the SEMIC7 standard. The product is mainly used as semiconductor silicon wafer cleaning agent, etching agent and photoresist remover. It can also be used for the preparation of edge layer with high requirements, and the removal of inorganic impurities in electroplating solution, The processing of copper, copper alloys, gallium and germanium in the electronic industry, and the candle engraving and cleaning of solar silicon wafers. In the process of treatment, the impurities in the reagent will have a fatal impact on the performance of components. Therefore, ultra clean and high-purity hydrogen peroxide has very strict requirements for purity.